The study, published in the Journal of Materials Science: Metallurgy, was led by Serkan Öğüt of Marmara University together with colleagues including Tayebeh Mousavi and Tahereh Zargar of King’s College London, Yi Huang of Bournemouth University, and Terence G. Langdon of the University of Southern California. Their work is the first to demonstrate complete solid-state mixing of copper and vanadium into a bulk nanostructured composite using this method, extending a line of research that previously succeeded with other immiscible pairs such as copper-tantalum and copper-molybdenum.

The experimental approach was deceptively simple in concept. The researchers took thin disks of oxygen-free copper and pure vanadium, each ground to a thickness of 0.8 millimeters, and stacked them in a sandwich configuration with vanadium between two copper layers. These stacks were then placed between massive anvils and processed under a pressure of 6.0 gigapascals at room temperature. As the anvil rotated, the disks were twisted through numbers of turns ranging from just half a rotation all the way up to 250 full turns, generating equivalent strains so extreme that they cannot be practically achieved by any conventional deformation process.

Optical microscopy of the processed disks revealed a clear progression of mixing with increasing turns. After 10 turns the copper and vanadium layers remained sharply defined with no fragmentation. By 20 turns, the vanadium layer had begun to break apart in the outer regions of the disk, and by 50 turns substantial mixing was visible from the half-radius to the edge. Complete mixing required patience and mechanical extremity: only after 200 to 250 turns did the cross-sections take on the uniform grey appearance of a fully blended alloy, with homogenization spreading inward from the disk edges toward the center as strain accumulated.

Scanning electron microscopy and energy-dispersive X-ray spectroscopy confirmed the microscopic reality behind the visible transformation. In the 200-turn sample, the copper layers contained between roughly 15 and 35 percent vanadium, evidence of mutual dissolution far beyond the equilibrium solubility, which is a mere 0.08 weight percent for vanadium in copper at room temperature. In the 250-turn sample, the edge regions showed no trace of pure copper or vanadium at all, instead forming a uniform copper-20 atomic percent vanadium solid solution, while the disk center displayed a matrix of similar composition with thin vanadium-rich layers of roughly copper-70 vanadium-30.

X-ray diffraction provided independent confirmation of the alloying. As the number of turns increased, the diffraction peaks of vanadium gradually vanished while the copper peaks shifted toward lower angles, a signature of the copper lattice expanding as larger vanadium atoms, with an atomic radius of 134 picometers versus 128 picometers for copper, substituted into the crystal structure. Quantitative analysis using Vegard’s law yielded an average vanadium concentration of approximately 19 percent across the entire disk. The copper crystallite size simultaneously collapsed to roughly 12 nanometers after 250 turns, accompanied by a lattice microstrain of about 1.7 percent, numbers that reflect the extraordinary defect density generated during processing.

Transmission electron microscopy of the 200-turn sample revealed a striking bimodal heterostructure. Coarser regions of approximately 100 nanometer grains, rich in copper with only trace vanadium, coexisted with much finer regions of 20 to 30 nanometer grains in which copper and vanadium were thoroughly mixed. The presence of straight twins and relatively few dislocations in the coarser grains indicates that dynamic recrystallization occurred during processing, continuously renewing the microstructure even as deformation ground it finer.

The mechanical consequences were dramatic. Hardness mapping showed values climbing from about 100 to 200 Hv in the barely deformed samples to a range of 350 to 400 Hv after 200 and 250 turns, substantially higher than either HPT-processed pure copper or pure vanadium. Tensile testing of the 200-turn sample after a gentle post-processing anneal at 773 Kelvin for one hour produced the headline result: an ultimate tensile strength near 1300 megapascals with 3.5 percent elongation, compared with roughly 1200 megapascals for HPT-processed pure vanadium and only about 400 megapascals for HPT-processed pure copper. The team attributes this strength to a combination of solid solution strengthening from dissolved vanadium, interface barriers to dislocation motion, Hall-Petch strengthening from nanoscale grains, and a dispersion of fine vanadium-rich grains acting somewhat like precipitate hardening.

The annealing experiments also revealed a fascinating thermal trade-off. At 773 Kelvin, hardness dropped only in the disk center, where copper-rich regions recovered preferentially while the vanadium-rich nanocrystalline zones resisted growth. At 973 and 1173 Kelvin, recrystallization swept the entire cross-section, dropping strength to about 800 and 500 megapascals respectively while boosting elongation to roughly 30 and 50 percent. This tunable strength-ductility balance, with coarse copper-rich grains contributing ductility and fine mixed grains contributing strength, mirrors the heterostructure design principles currently exciting the structural materials community.

The motivation runs deeper than record strength alone. Vanadium offers low density of 6.1 grams per cubic centimeter against 10.2 for molybdenum and 16.4 for tantalum, along with a low neutron activation cross-section, making copper-vanadium alloys attractive for high-strength electrical conductors in high-field magnets, demanding electrical contacts, and particle accelerator components. Because vanadium barely dissolves in copper under equilibrium, it can in principle strengthen the matrix without degrading electrical conductivity, though the researchers note that direct resistivity measurements on their HPT-processed alloy remain a task for future work, since severe deformation can create non-equilibrium solid solutions with different transport behavior. Whether spinning metals under gigapascals of pressure becomes an industrial route or remains a laboratory marvel, the demonstration that room-temperature torsion can rewrite the rules of alloying opens a genuinely new page in materials design.

Subject of Research: Room-temperature solid-state alloying of immiscible copper and vanadium by high-pressure torsion

Article Title: Fabrication of immiscible Cu-V alloy by high-pressure torsion

Article References: Öğüt, S., Zargar, T., Mousavi, T., Georges, L., Ghosh, S., Hamada, A., Abd-Elaziem, W., Huang, Y., & Langdon, T. G. (2025). Fabrication of immiscible Cu-V alloy by high-pressure torsion. Journal of Materials Science: Metallurgy, 1(1), Article 2. https://doi.org/10.1007/s44492-025-00002-w

Image Credits: AI Generated

DOI: 10.1007/s44492-025-00002-w

Keywords: copper-vanadium alloy, high-pressure torsion, severe plastic deformation, immiscible metals, nanostructured materials, solid solution strengthening, ultrafine grains, mechanical alloying, tensile strength, electrical conductors, vanadium, copper

The defining trick of a high entropy alloy lies in its name. Where a conventional alloy is dominated by a single base metal doped with trace additions, an HEA dissolves five or more elements at concentrations of roughly 5 to 35 atomic percent, typically with atomic radii differing by less than 15 percent. The authors note that the field has converged on a second, thermodynamic definition as well: a genuine HEA must possess a configurational entropy of at least 1.5R, where R is the gas constant, meaning the sheer number of possible atomic arrangements is large enough to stabilise simple solid solution phases instead of brittle intermetallic compounds. The result is a material whose structure and properties can be tuned not by tweaking a trace element but by redesigning the entire elemental recipe.

The review organises the field around four so-called core effects, first outlined by Jien-Wei Yeh and completed by S. Ranganathan in 2003. The high entropy effect favours stable, disordered solid solutions; sluggish diffusion slows the rate at which atoms move and phases transform; severe lattice distortion arises because every atom is surrounded by neighbours of different sizes, straining the crystal; and the cocktail effect captures the surprising composite behaviours that emerge when many elements interact at once. Crucially, each of these effects has a direct electromagnetic consequence. Lattice distortion bends electronic energy bands, splits energy levels and creates localised states between the valence and conduction bands, modulating conductivity and dielectric response in ways conventional alloys cannot easily replicate.

That structural disorder translates into an unusually rich toolbox of electromagnetic loss mechanisms. When a microwave strikes an HEA, energy is dissipated through electronic polarisation, as electron clouds shift against their nuclei in the local electric fields created by chemically distinct atoms; through interfacial polarisation, as charges pile up at grain and phase boundaries; through magnetic loss, as magnetic domains in ferromagnetic alloys containing iron, cobalt, nickel or manganese respond and resonate; and through conductive loss, as free electrons oscillate and convert wave energy into heat via Ohmic heating. The challenge, the authors stress, is balance: too much conductivity turns an absorber into a mirror, and a large mismatch between the material’s impedance and that of free space causes most of the wave to reflect away before it can be absorbed.

Impedance matching is therefore the central design problem, and here HEAs offer unusual flexibility. Because complex permittivity and complex permeability can both be adjusted through composition, HEAs can be engineered to bring the material impedance closer to that of ambient space, minimising the reflection coefficient while maximising the attenuation constant that governs how quickly the wave’s amplitude decays inside the absorber. The quantitative payoff is striking. Reported reflection losses for HEA-based materials span from about minus 10 decibels, the threshold below which 90 percent of incident power is absorbed, down to roughly minus 70 decibels, depending on composition, thickness and frequency. The reviewed literature includes an FeCoNiMnCu0.5 alloy with a reflection loss of minus 71.0 decibels at 6.79 gigahertz from a layer just 2.93 millimetres thick, and boron-doped FeCoNiCr alloys reaching minus 62.5 decibels at 2.11 millimetres.

Getting there, however, takes careful processing. Because pure HEAs tend to be strongly metallic and conductive, the review describes several engineering strategies for taming them. Mechanical alloying, particularly high-energy ball milling, flattens spherical particles into high aspect ratio flakes that promote multiple polarisation events and tune the complex electromagnetic parameters. Annealing then sharpens crystallinity and boosts saturation magnetisation: FeCoNiAlCr0.9 powders improved from minus 26.88 to minus 47.55 decibels after heat treatment, while FeCoNiMn0.5Al0.2 annealed at 500 degrees Celsius delivered minus 44.425 decibels over a 3.825 gigahertz bandwidth. Surface modifications do impressive work too. Phosphating FeCoNiMn flakes produced a protective layer that lifted performance to minus 62.4 decibels at 10.7 gigahertz while adding corrosion and oxidation resistance, and dealloying, which leaches aluminium out of FeCoNiCuAl surfaces, enhanced impedance matching and pushed losses past minus 56 decibels at two separate frequencies.

Doping and compositing broaden the palette further. Adding small amounts of non-metals such as carbon, nitrogen or boron introduces ionic character and dipole oscillations that feed dielectric loss; boron-doped FeCoNiCr alloys achieved a maximum bandwidth of 5.78 gigahertz while retaining mechanical strength and oxidation resistance. Encapsulating HEA nanoparticles in graphitic carbon shells, via routes from arc discharge in methane to metal-organic chemical vapour deposition, simultaneously improves impedance matching and reduces radar cross-section, with one carbon-coated FeCoNiCuMn composite reaching minus 65.8 decibels and an absorption width of 7.68 gigahertz. Pairing HEAs with polymers, oxides or ceramics blends the alloy’s magnetic loss and structural stability with the partner phase’s dielectric loss, as in FeNiCrMn-polylactic acid composites printable by fused deposition modelling, and FeCoNi(Si0.6Al0.2B0.2) powders embedded in paraffin, which the review singles out as among the most versatile performers, combining thin 1.2 to 2.0 millimetre layers with reflection losses down to minus 44.1 decibels in the X and Ku bands.

Measuring all this in a way that matters outside the laboratory is its own discipline, and the review devotes detailed attention to it. Vector network analysers paired with horn antennas measure scattering parameters such as S11 and S21 in free-space fixtures, from which shielding effectiveness and reflection loss are derived; HEA-reinforced carbon fibre composites tested this way achieved total shielding of about 45.9 decibels at 4 gigahertz. Open area test sites, with calibrated ground planes and antennas separated by 3 to 30 metres, serve compliance testing of large enclosures, while indoor anechoic chambers lined with pyramidal absorbers provide reflection-free environments for monostatic and bistatic radar cross-section measurements across controlled angles, polarisations and frequency sweeps. The review reports HEA composite radar cross-section reductions of roughly 10 to 30 decibels in chamber tests, and notes that such measurements bridge laboratory-grade shielding data and real-world electromagnetic detectability.

Obstacles remain before these alloys fly on actual aircraft. The authors highlight the absence of standardised testing protocols across frequency bands and environments, which makes comparing studies difficult; edge effects and sample size limits that hamper scaling VNA results to full components; interfacial stability and oxidation concerns when HEAs are coupled with polymers; and early-stage cost and manufacturability. Even the frequency coverage is lopsided: most HEA research targets the C and X bands central to military radar and communications, leaving S-band and Ku-band coverage comparatively underexplored. The review calls for quantitative assessment of absorption mechanisms, a firmer physical understanding of lattice distortion, scalable synthesis, multi-scale modelling and durability testing under extreme conditions as the priorities that will determine whether laboratory spectacles become fielded technologies.

The most transformative possibility, the authors argue, lies in merging HEA chemistry with additive manufacturing. Because 3D printing can control composition, microstructure and geometry simultaneously, it promises lightweight graded structures whose electromagnetic response is designed in from the melt, capable of surviving high temperatures and corrosive atmospheres while retaining their absorption performance. From stealth platforms and radar-visible UAV signatures to telecommunications, energy storage and even healthcare electronics, the combination of chaotic multielement chemistry and precision manufacturing offers something conventional absorbers cannot: a single material family whose dielectric and magnetic personalities can be tuned almost at will. If the remaining manufacturing and standardisation hurdles fall, the alloys once prized mainly for their strength and heat resistance may quietly become the invisible backbone of an electromagnetically cleaner, harder-to-detect world.

Subject of Research: High entropy alloys as electromagnetic wave absorbing materials for stealth and shielding applications

Article Title: A review on high entropy alloys as an absorber of electromagnetic radiation

Article References: Gowda, N. R., Setupathy, A., Raj, A. A. B., & Thangaraju, S. (2026). A review on high entropy alloys as an absorber of electromagnetic radiation. Journal of Materials Science: Metallurgy, 1(1), Article 5. https://doi.org/10.1007/s44492-026-00006-0

Image Credits: AI Generated

DOI: 10.1007/s44492-026-00006-0

Keywords: high entropy alloys, electromagnetic wave absorption, stealth technology, radar cross section, impedance matching, magnetic loss, dielectric loss, radar absorbing materials, electromagnetic interference shielding, mechanical alloying, additive manufacturing, lattice distortion

High-entropy alloys, first introduced in 2004, break with the traditional recipe of metallurgy. Instead of one dominant element seasoned with trace additives, they mix four or more principal elements in near-equal proportions. The resulting configurational entropy stabilizes simple crystal structures, typically face-centered cubic or body-centered cubic lattices, and suppresses the brittle intermetallic compounds that plague conventional alloys. The FeMnCrNi family studied here is particularly attractive because it avoids expensive, strategically sensitive elements like cobalt and tungsten, offers excellent biocompatibility, and retains exceptional toughness at cryogenic temperatures, making it a candidate for liquid-hydrogen storage tanks, aerospace propulsion components, and nuclear reactor structures.

The catch has always been strength. Single-phase high-entropy alloys of this family yield at modest stresses, far below what heavy-load, wear-coupled service environments demand. The Taiyuan team’s answer was a ternary carbide strategy. They blended 5 weight percent of TiC, SiC, and ZrC powders into mechanically alloyed FeMn0.25CrNi powder in two different ratios, designated Ti2Si2Zr1 and Zr2Si2Ti1, and consolidated the mixtures by spark plasma sintering at 1,050 degrees Celsius under 60 megapascals of pressure for just three minutes. The rapid, pulsed-current process proved decisive: instead of surviving as inert ceramic particles, the added carbides largely dissolved and reacted with the chromium-rich matrix, precipitating in-situ nanoscale M23C6 chromium carbides dispersed both inside grains and along their boundaries.

X-ray diffraction confirmed that the FCC structure persisted in all samples, with no detectable peaks from the added carbides, evidence of their near-complete dissolution. The diffraction peaks of the composites shifted to higher angles, a fingerprint of interstitial carbon squeezing into the lattice and contracting the interplanar spacing, compounded by residual compressive stresses from the thermal expansion mismatch between ceramic and metal. Scanning electron microscopy and energy-dispersive mapping revealed dark, carbide-enriched regions studded with particles smaller than 500 nanometers, while the unreinforced matrix remained a clean, single-phase solid solution. The carbides in the composites, the authors conclude, originate from interfacial reactions between the ceramic precursors and the alloy, not from the matrix itself.

Electron backscatter diffraction quantified the microstructural payoff. Average grain size shrank from 2.28 micrometers in the matrix alloy to 0.93 micrometers in the Ti2Si2Zr1 composite and 1.07 micrometers in Zr2Si2Ti1. The mechanism is classical Zener pinning: finely dispersed carbides anchored at grain boundaries physically block their migration during sintering. Kernel average misorientation maps showed elevated dislocation densities concentrated near grain boundaries and carbide-matrix interfaces, generated by thermal mismatch stresses during rapid cooling, an additional reservoir of stored strain energy that contributes to strengthening. Relative densities exceeded 97.5 percent for all sintered bodies, confirming that the process achieved near-full consolidation without sacrificing microstructural control.

The mechanical results are where the design philosophy shines. Against the matrix alloy’s 836 megapascal yield strength, Ti2Si2Zr1 reached 1,274 megapascals, a 52 percent increase, with an ultimate compressive strength of 1,944 megapascals and only a modest ductility penalty. The Zr2Si2Ti1 variant, with zirconium carbide dominating the mix, yielded at 1,156 megapascals. Crucially, Ti2Si2Zr1 outperformed a broad field of carbide-reinforced high-entropy alloy composites reported in the literature on the strength-ductility trade-off, a balance that usually collapses when hard ceramics are added.

To understand why, the team built a quantitative strengthening model that superimposes four contributions: Hall-Petch grain boundary strengthening, Orowan bypass of dispersoids, solid-solution strengthening from interstitial carbon and silicon, and precipitation strengthening from the M23C6 carbides. The calculation predicted a yield strength of 1,291 megapascals, within about 30 megapascals, or less than 2 percent, of the measured value. Grain refinement contributed roughly 431 megapascals, Orowan strengthening about 438 megapascals, precipitation strengthening 438 megapascals, and solid-solution strengthening 85 megapascals. That level of agreement validates the model as a predictive design tool rather than a retrospective explanation, offering a roadmap for tuning carbide ratios in future alloys.

Tribological testing told an equally compelling story. Slid against silicon nitride counterfaces under a 10-newton load, the Ti2Si2Zr1 composite posted a steady-state friction coefficient of 0.475 and a wear rate of 3.6 x 10^-5 cubic millimeters per newton-meter, roughly half that of Zr2Si2Ti1 and an order of magnitude below the matrix alloy’s 16.7 x 10^-5. The trend tracks the Archard equation, which ties wear volume inversely to hardness, but microstructure mattered too: finer grains, smaller carbides, and a denser, more stable oxide film on the worn surface combined to suppress abrasive plowing and adhesive delamination.

X-ray photoelectron spectroscopy of the worn Ti2Si2Zr1 surface revealed a multilayered tribo-oxidation film: outer iron and manganese oxides including Fe3O4, Fe2O3, and various manganese oxides, an intermediate chromium oxide layer dominated by chemically stable Cr2O3, and an inner layer rich in metallic nickel. When the oxide film’s formation rate outpaced its fracture rate, as in Ti2Si2Zr1, the film acted as a self-protecting barrier that lowered friction and shielded the surface. The dominant wear mechanisms across all samples were abrasive wear accompanied by mild adhesive wear, with periodic delamination of oxide flakes marking the transition between regimes.

The work, funded by the Fundamental Research Program of Shanxi Province and the Key Technologies R&D Program of Shanxi Province, demonstrates that a carefully balanced trio of carbides can dissolve, react, and reprecipitate into a strengthening architecture that no single additive could deliver. By dissolving the reinforcement and rebuilding it in place at the nanoscale, the researchers sidestepped the weak interfaces and agglomeration that doom many ceramic-metal composites. For industries seeking cobalt-free, cryogenically tough, wear-resistant structural materials, the message is clear: sometimes the strongest alloys are the ones that take their reinforcement apart and put it back together again.

Subject of Research: TiC-SiC-ZrC hybrid carbide-reinforced FeMn0.25CrNi high-entropy alloy composites fabricated by spark plasma sintering

Article Title: Mechanical and tribological properties of TiC-SiC-ZrC hybrid carbide-reinforced FeMn0.25CrNi high-entropy alloy composites prepared by spark plasma sintering

Article References: Ji, X., Zhang, M., Zhang, Z., Yang, H., & Qiao, J. (2026). Mechanical and tribological properties of TiC-SiC-ZrC hybrid carbide-reinforced FeMn0.25CrNi high-entropy alloy composites prepared by spark plasma sintering. Journal of Materials Science: Metallurgy, 1(1), Article 14. https://doi.org/10.1007/s44492-026-00013-1

Image Credits: AI Generated

DOI: 10.1007/s44492-026-00013-1

Keywords: high-entropy alloy, carbide reinforcement, spark plasma sintering, mechanical alloying, strengthening mechanisms, tribological properties, wear resistance, M23C6 carbides, grain refinement, Zener pinning, Orowan strengthening, metal matrix composites