Set three of the Encyclopedia of Thermal Packaging — released

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Thermal and mechanical packaging–the enabling technologies for the physical implementation of electronic systems–are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. As the industry approaches the end of “Moore’s Law,” packaging is playing an ever larger role in defining the attributes and performance limits of electronic components and systems.

The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as servers and cell phones and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications.

Set 3 of the Encyclopedia of Thermal Packaging, an encyclopedia compiled in four multi-volume sets, has now been released. Following on the success of Set 1: Thermal Packaging Techniques, and Set 2: Thermal Packaging Tools, Sets 3 and 4 deal with Thermal Packaging Applications and Configurations.

Each of the contributed volumes present the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics. When completed, the 4-set Encyclopedia of Thermal Packaging will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging.

The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging “learning curve,” the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Set 3: Thermal Packaging Applications

The just-released third set in the Encyclopedia includes two volumes in the planned focus on Thermal Packaging Applications and a single volume on the use of Phase Change Materials (PCM), a most important Thermal Management Technique, not previously addressed in the Encyclopedia.

Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics. Along with a detailed presentation of the relevant thermofluid physics and governing equations, and the supporting mathematical design and optimization techniques, the book offers a practical guide for thermal engineers designing avionics cooling equipment, based on the author’s 20+ years of experience as a thermal analyst and a practical design engineer for Avionics and related systems.

The Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations. This unique text was written by 3 authors, Dr John D Albrecht, Mr David H Altman, Dr Joseph J Maurer, with extensive US Department of Defense and aerospace industry experience in the design, development, and fielding of RF systems. Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today’s technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks.

The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries. These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.

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This encyclopedia set retails for a special introductory price of US$990 / £870 until 28 February 2019. To know more about the book visit http://www.worldscientific.com/worldscibooks/10.1142/10975.

To know more about the Encyclopedia of Thermal Packaging series, visit https://www.worldscientific.com/series/etp.

About the Series Editor

Dr Avram Bar-Cohen is an internationally recognized leader in energy science and technology, Life Fellow of IEEE, and an Honorary Member of ASME. He is currently serving as a Principal Engineering Fellow at Raytheon Corporation — Space and Airborne Systems. His publications, lectures, short courses, and research, as well as his US government and professional service in IEEE and ASME, have helped to create the scientific foundation for the thermal management of electronic components and systems. His current efforts focus on the system and thermal architecture of directed energy systems. He also continues to pursue and advocate for the emerging Gen3 Embedded Cooling paradigm for high heat flux electronic and photonic components in computational, RF, and laser systems.

Bar-Cohen is the first President of the newly-renamed IEEE Electronic Packaging Society (2018-2019) and has earlier served several terms on the CPMT Board of Governors, represented the Society as a Distinguished Lecturer for more than 15 years, and is a past Editor-in-Chief of CPMT Transactions (1995-2005). In 2014 he was honored by IEEE with the prestigious EPS (then CPMT) Field Award and had earlier been recognized with the CPMT Society’s Outstanding Sustained Technical Contributions Award (2002), the ITHERM Achievement Award (1998) and the THERMI Award (1997). Bar-Cohen has also received the Luikov Medal from the International Center for Heat and Mass Transfer in Turkey (2008), ASME’s Heat Transfer Memorial Award (1999), Edwin F. Church Medal (1994), and Worcester Reed Warner Medal (1990). From 2010 to 2016, Bar-Cohen served as a Program Manager in the Microsystem Technology Office at the US Defense Advanced Projects Agency in Virginia. Earlier he served as the Chair of Mechanical Engineering and Distinguished University Professor at the University of Maryland and is currently on a leave-of-absence from that institution. From 1998 to 2001 he directed the University of Minnesota Center for the Development of Technological Leadership and held the Sweatt Chair in Technological Leadership.

He is a past member of ASME’s Board on Professional Development and Board on Research and Technology Development, served a 3-year term as ASME VP of Research (1998-2000) and is also a past President of the Assembly of International Heat Transfer Conferences (2010-2014). Bar-Cohen is the Editor-in-Chief of the Encyclopedia of Thermal Packaging, co-editor-in-chief of the Encyclopedia of Packaging Materials, Processes, and Mechanics, the series editor-in-chief of the “World Scientific Series in Emerging Technology” and the co-series editor-in-chief of the “WSPC Series in Advanced Integration and Packaging” book series.
Bar-Cohen has co-authored Dielectric Liquid Cooling of Immersed Components (WSPC, 2013), Design and Analysis of Heat Sinks (Wiley, 1995), and Thermal Analysis and Control of Electronic Equipment (McGraw-Hill, 1983), and has edited/co-edited another 40 books in this field. He has also authored/co-authored more than 400 journal papers, refereed proceedings papers, and chapters in books and has delivered some 100 keynote, plenary and invited lectures at major technical conferences and institutions. He holds 8 US and 3 Japanese patents and has advised to completion more than 70 Masters and PhD students at the University of Maryland, the University of Minnesota, and the Ben Gurion University in Beer Sheva, Israel.

About the Authors

Boris M Abramzon is currently an independent consultant in the field of electronic cooling equipment, compact heat exchangers and airborne environmental control systems. He has taught several professional courses on compact heat exchangers and electronics cooling for engineers, and graduate and postgraduate courses on thermal analysis and design of electronic equipment at the Ben-Gurion University of the Negev and Tel Aviv University. He holds a Master of Science degree in thermo-physics from the Leningrad Polytechnic Institute, Russia, and a PhD in Mechanical Engineering from the Ben-Gurion University of the Negev, Israel. From 1984 to 1987 he was a Research Associate at the University of California, Irvine. From 1990 to 2001, he was a Head of the Heat Transfer Group at TAT Technologies, Ltd. From 2001 to 2011, he was a Senior Thermal Analyst at ELOP Electro-Optics Industries, Ltd. Dr Abramzon has published over 50 conference and journal papers in areas of heat transfer, chemical technology, combustion theory, electronics cooling and numerical optimization.

John D Albrecht is currently an Associate Professor of Electrical and Computer Engineering at Michigan State University, USA. He holds a PhD degree from the University of Minnesota, USA. Prior to joining Michigan State University, he was a program manager in the Microsystems Technology Office at the Defense Advanced Research Projects Agency where he managed a broad portfolio of RF electronics projects that included millimeter-wave integrated phased arrays and device-level thermal management. He also worked at the Sensors Directorate of the Air Force Research Laboratory where he worked with the Subsystems and Components Division on research from the electronic device level to subsystems for a wide variety of RF aperture subsystems. He held several leadership positions within Sensors Directorate and has published more than 100 journal and conference papers over the last 25 years. Early in his career, he was a National Research Council Postdoctoral Fellow at the US Naval Research Laboratory in Washington DC, where he studied quantum effects in solid-state materials and devices.

David H Altman is an Engineering Fellow at Raytheon Integrated Defense Systems. David has 16 years of experience designing, developing, analyzing and testing thermal management systems for radar and other high-power defense electronics systems. Over this period, David has developed liquid cooling systems, cold plates, heat spreaders and integrated thermal management systems that are employed in fielded Raytheon products. As a member of Advanced Technology Programs, his current work focuses on the development of new thermal management and energy system technologies. David holds BS and MS degrees from Rensselaer Polytechnic Institute, USA and Boston University, USA. He has authored or co-authored over twenty peer reviewed technical publications and holds ten US patents related to electronics cooling.

Yoram Kozak is a Postdoctoral Research Assistant at the Department of Aerospace Engineering of Texas A&M University in College Station, Texas, USA. He earned his BSc, MSc and PhD degrees from the Department of Mechanical Engineering at Ben-Gurion University of the Negev in Beer-Sheva, Israel. His research deals with experimental and numerical modeling of phase-change materials for energy storage and thermal management applications, and numerical investigation of multiphase turbulent combustion. He has co-authored 8 journal articles and more than 30 conference papers. He received the Rieger Foundation-Jewish National Fund Fellowship in Environmental Studies for 2015-2016, and the Negev Fellowship for PhD studies in Ben-Gurion University of the Negev, Beer-Sheva, Israel for 2012-2016.

Joseph J Maurer is a Senior Principal Engineer at Raytheon Space and Airborne Systems. Joseph joined Raytheon in August 2015 focusing on research and development programs in advanced electronics, thermal management, and heterogeneous integration. His work at Raytheon encompasses initial idea development, engineering across multiple disciplines, and program management. Prior to joining Raytheon, Joseph spent nearly 7 years at Booz Allen Hamilton as a consultant to the Defense Research Projects Agency (DARPA), specifically DARPA’s Microsystems Technology Office (MTO). His work there included programs in advanced thermal management, millimeter wave electronics, and III-V devices such as GaN, InP, and SiGe. Joseph holds MS and PhD degrees from the University of Virginia, USA in and a BS from Brown University, USA — all in Chemical Engineering. He has authored or co-authored over 15 publications and presentations and is a Senior Member of the IEEE.

Gennady Ziskind is Professor and Head of the Department of Mechanical Engineering at Ben-Gurion University of the Negev in Beer-Sheva, Israel. He earned his MSc and DSc degrees from the Faculty of Mechanical Engineering at the Technion-Israel Institute of Technology. His research deals with various aspects of heat and mass transfer and multiphase systems, including phase-change energy storage and thermal management, with the focus on experimental and numerical studies of solid-liquid phase change on fundamental and applied levels. He has co-authored more than 60 journal articles and more than 100 conference papers. Among other international activities, Dr Ziskind serves as Associate Editor of ASME Journal of Heat Transfer, a delegate to the Assembly of International Heat Transfer Conferences, a member of ASME Safety Standards Committee for Thermal Energy Storage (TES) Systems, and an active member of several European research frameworks. Dr Ziskind co-chaired the Eurotherm Seminar 99: Advances in Thermal Energy Storage in Spain in 2014 and organized INNOSTORAGE-Advances in Thermal Energy Storage International Conference in Israel in 2016.

About World Scientific Publishing Co.

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