4th CIES Technology Forum

Bridge to a sustainable society by way of innovative integrated electronics systems

The Tohoku University Center for Innovative Integrated Electronic Systems(CIES) will host its fourth technology forum in Tokyo from March 22~23.

CIES is engaged in research and development with domestic and international companies to create the latest in energy-saving integrated electronics technology. Industry collaborators includes specialists in the fields of materials, equipment, devices, circuits and systems. The center will introduce its activities at the 4th CIES Technology Forum.

Day one of the forum will focus on the integrated electronics contributing to growth industries in IT and transportation systems. On day two of the forum, CIES will hold a progress report on activities at the center, including joint research, national and regional collaborative projects.

Day 1: International Symposium (& banquet)

Date: Thursday, March 22
Time: 10:30 a.m.-5:30 p.m.

Day 2: CIES Progress Report

Date: Friday, March 23,
Time: 10:00 a.m.-5:50 p.m.

Venue: Station Conference Tokyo Sapia Tower 5F

1-7-12 Marunouchi, Chiyoda-ku, Tokyo 100-0005

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Attendees: domestic and foreign researchers in industry and academia, and government officials.
Participation is free (a separate fee applies for the banquet)

Application: Please apply from the link below on the website.

http://www.cies.tohoku.ac.jp/4th_forum/entry.html

Deadline: 3 p.m Wednesday, March 14

The international symposium will be held in English and the CIES progress report in Japanese.

Media Contact

Center for Innovative Integrated Electronic Systems
support-office@cies.tohoku.ac.jp
@TohokuUniPR

http://www.tohoku.ac.jp/en/

https://www.tohoku.ac.jp/en/events/special_event/4th_cies_tech_forum.html

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